The future of packaging companies is involved in the chip and application side
August 10 07:03:34, 2019
Since 2014, CSP (Chip-Scale Package), which was first introduced by international LED giants such as Lumileds, Samsung, and Epistar, has become a hot topic in this industry after more and more chips and packaging manufacturers have joined the industry. The Guangzhou International Lighting Exhibition is even more popular. Although there are still many technical difficulties in CSP at this stage, its emergence will bring more changes to SMD, COB and other products, and the prospects are promising. Aladdin News Center reporter recently interviewed Dr. Liu Guoxu, CTO of Yimeixinguang (Beijing) Technology Co., Ltd., a representative manufacturer of LED packaging innovation in China, to understand the current LED packaging technology and market status, so as to analyze the development of the future packaging industry. trend. CTO Liu Guoxu from CTO of Yimeixinguang (Beijing) Technology Co., Ltd. is the biggest challenge of CSP. The biggest advantage of CSP is that chip package is made smaller and optically matched, which increases the flexibility of light source use and reduces cost. The space potential is also greater, and because it directly removes the primary package interface (bracket or substrate), it also has an advantage in heat dissipation. CSPs typically use flip-chip or vertical structure chips that can be driven with higher current densities and higher luminous flux per unit area. In recent years, the gross profit margin of the packaging industry has continued to decline sharply, and corporate profits have been continuously diluted. Liu Guoxu said frankly that prices will continue to decline this year, but will gradually slow down because some basic materials are nearing the limit. Especially when using CSP package, in the cost of BOM, the chip accounts for more than 80%. In the current price/performance ratio, the future price advantage of CSP is particularly attractive. This is also the technical direction for upstream and midstream companies to provide more competitive light sources for downstream customers. However, how to use it on the application side is a big challenge. Some traditional luminaire assembly plants do not accept CSPs very much, because existing patch devices may not meet the fine requirements of CSP small-size chips. If used improperly, some will appear. Quality and reliability issues. Liu Guoxu bluntly said. Moreover, the current development of CSP lacks uniform standards, such as lighting power 2835 and 3030, and backlight power 4014, 5630, which has been accepted by the industry as a size standard. If CSP is in chip size and appearance size and light distribution angle It can gradually form standardization, and it may develop faster. The spread of CSP in the field of LED packaging allows rumors that 2015 will be the first year of CSP device promotion and application in the industry. Liu Guoxu believes that this is not appropriate, because for some foreign companies Not a meta point, they have been in mass production for a year or two. Among foreign brands, Lumileds' CSP products are in a leading position. They have been mass-produced for more than a year in the field of mobile phone flash; South Korea's Samsung has launched the second-generation CSP technology, which is not only used in light distribution, but also in lighting. Attempt; Seoul Semiconductor is the first to use CSP in TV backlighting, and so on, the CSP technology of some foreign brand packaging factories is maturing. In China, this year's CSP technology is more comprehensive. Liu Guoxu said that Yimeixinguang started to develop CSP more than a year ago. At present, it is in the trial production stage and has the capacity to produce, whether it is technology, technology or product reliability. More mature, now mainly looking for some applications, such as backlight, flash, but it may take some time to apply to the lighting field, because the use of more medium power in the lighting, may require a smaller size CSP, in addition to In addition to the challenges of the patch mentioned above, the improvement of light efficiency and the embodiment of cost-effectiveness will need to be further improved. Although CSP will grow faster in the next year or two, it will not necessarily occupy the market share. After all, the high-power SMD products, COB and ceramics have matured and are widely accepted by the market, and will still account for most of the market. According to Strategy Unlimited, 2014 mid-power SMD SMDs account for nearly half of the market, and in 2015, with the further penetration of bulbs and lamp replacement markets, it will remain the main form of packaging. In the large-scale production of substitute lamps and TV backlights, the light efficiency, yield and production capacity of the products are very mature.
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