Analysis of the development trend of China's LED packaging device industry
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September 01 11:06:37, 2021
(1) Flip-chip type LED chip package In addition to the vertical type chip, the flip chip type is also the development goal of the industry. The production of flip chip is much simpler than the three-dimensional type, and can avoid complicated processes, which greatly improves the feasibility of mass production. Together with the mature technology of the gold-finger and via technology of the back-end chip technology, it is necessary to plant multiple golden balls in the past. The solid crystal mode is transformed into a large-area P and N electrode direct adhesion bracket, which is combined with the eutectic solid crystal method, which greatly simplifies the technical threshold of the flip chip type chip package, and further shortens the package heat dissipation path compared with the horizontal type. The chip has better heat dissipation capability, and the driving voltage can also be reduced. Under the drive of energy saving and carbon reduction in the future, flip chip packaging will be a good solution. Based on the above packaging considerations, the main packaging technologies currently employed are phosphor coating and transfer processes. Fluorescent coating is a technology developed by Everlight. It is mainly coated with a thin fluorescent layer on the chip, which can greatly improve the luminous efficiency of the module. At present, Yiguang has applied this product to high-power parts. The transfer process technology was originally used in small surface mount products, and the technology was further applied to high-power models, overcoming technical problems such as silicon molding and sticking. Currently, due to TV, etc. The power of the backlight assembly is improved and the reliability is required. The traditional PPA reflective cover substrate is an organic material, which cannot provide better heat resistance and light resistance like silicon or resin. In order to effectively improve the reliability, it is planned to apply this transfer technology. The backlight assembly is on the product. Regarding the package size, the minimum high-power package size that can be achieved at present is 3.03.0mm or even 2.02.0mm or less. However, the most common specification currently on the market is 3.53.5mm. The application of this product is applicable. It is extremely broad. Therefore, Yiguang is a pioneer in the era of solid-state lighting. Yiguang Electronics will continue to apply small-size high-power technology to this product, with low-cost aluminum nitride ceramic substrates and high-reflectivity mirrors. Implementation, the package bracket required for the production of this product, in addition to the application of the common gold solid crystal process technology, the metal is quickly guided from the center of the LED to the high thermal conductivity aluminum nitride ceramic, in order to reduce the operation of the LED assembly. Temperature, high efficiency (150lm / w), high power (3-5W operation), long life (60000hrs), low energy LED product performance. The chip selection will work with high-quality partners around the world to improve the quality and reduce the cost of existing chips, as well as the rapid development of new chip structures, in order to reduce the existing LED chips with the lowest cost mass production of silicone molding technology. The packaging cost of the process, and the fast-reacting optical structure design meets the light-harvesting effect of the new design chip structure, in order to achieve the design goal of the lowest production cost and highest efficiency. (2) LED packaging of 20W or more in LED packaging, COB packaging technology is another major focus. LEDs below 10W are not suitable for COB packaging technology. In this field, a single high-power package is still used in the mainstream; LEDs above 20W are more suitable. Adopt COB packaging technology. At present, the LED bulb market in Japan is mainly converted to COB polycrystalline packaging. Traditional high-power chips and modules are mostly used for directional LED sources such as MR16. At present, aluminum substrates, copper substrates, ceramic substrates, and the like are used in COB packaging. The thermal conductivity of each material is different, resulting in differences in thermal conductivity, such as the thermal conductivity of diamonds is 1000, followed by silver and copper is about 400, then aluminum is more than 100, and the thermal conductivity of ceramics is between 8-22. Among the insulating materials, the thermal conductivity of ceramics is already good, and the price is cheap, so many packages choose ceramic substrates. (III) High-voltage LED package In addition to high-power LED, the packaging of high-voltage LED is also a major focus. The high-voltage LED package products span the 1W, 2W and 4W product markets, and the advent of high-voltage products is to solve the problem of excess energy consumption caused by the presence of the step-down circuit in solid-state lighting with a new thinking, and then assist the terminal consumption. Reduce the cost of purchase. At the same time, since the high-voltage LED chip itself has a sapphire substrate, the lateral light is stronger than the general chip. Therefore, the phosphor design of the full-angle uniform coating should be adopted in the package, so that the package body has the same temperature in the full-view role, thereby enhancing the light. the quality of. The packaging technology of high-voltage LED products focuses on the above advantages, and in addition, should provide consumers with more convenience, so that different regions can be quickly and conveniently applied under different voltage operating conditions. For example, the 4W products introduced by Everlight Electronics can directly use the line-parallel design of the circuit board to meet the global voltage requirements of 110V and 220V. And because the voltage across the single component package can reach 110V or even 220V, in the development of high-voltage LED package, Everlight Electronics insists on the use of insulated ceramic substrate package form to reduce the spark discharge of positive and negative electrodes between small sizes. Dangerous.